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Crusoe to Build 200MW AI Data Center, Then Expand at 1.2 GW Lancium Clean Campus
From insideHPC

Crusoe to Build 200MW AI Data Center, Then Expand at 1.2 GW Lancium Clean Campus

SAN FRANCISCO and Abilene, TX  — July 18, 2024 — Crusoe Energy Systems LLC announced it is building a 200 MW data center at the Lancium Clean Campus outside Abilene...

DOE and DARPA in Quantum Research Agreement
From insideHPC

DOE and DARPA in Quantum Research Agreement

July 16, 2024 — The U.S. Department of Energy (DOE) and the Defense Advanced Research Projects Agency (DARPA) announced a memorandum of understanding (MOU) to coordinate...

SMART Global Holdings to Become Penguin Solutions
From insideHPC

SMART Global Holdings to Become Penguin Solutions

NEW YORK – July 16, 2024 – Today, at its Nasdaq MarketSite Analyst Day event, SMART Global Holdings, Inc. (“SGH”) (NASDAQ: SGH) announced its intention to become...

QuEra Names Ory Acting CEO
From insideHPC

QuEra Names Ory Acting CEO

Boston, July 15, 2024 — Neutral-atom quantum computing company QuEra announced today that Alex Keesling will transition from CEO to take on a new role in leading...

Eviden and the IOTA Foundation Announce Digital Product Passport
From insideHPC

Eviden and the IOTA Foundation Announce Digital Product Passport

Paris – July 12, 2024 – Eviden today announced ,in partnership with the IOTA Foundation, the Eviden Digital Passport solution (EDPS), “powered by IOTA” technology...

MSBAI Secures DOE ASCR Frontier Aurora HPC Allocation
From insideHPC

MSBAI Secures DOE ASCR Frontier Aurora HPC Allocation

LOS ANGELES, July 1, 2024 — AI company MSBAI has been awarded an allocation on the Department of Energy’s leadership-class supercomputers through the ASCR Leadership...

Rescale Receives Success Memorandum from Defense Innovation Unit for HPC Modernization Program
From insideHPC

Rescale Receives Success Memorandum from Defense Innovation Unit for HPC Modernization Program

San Francisco – June 27, 2024 – Cloud HPC company Rescale announced the successful completion of an HPC Modernization Program prototype evaluation for the Department...

DOE ASCR July 22 Call for Papers: Workshop on Energy-Efficient Computing for Science
From insideHPC

DOE ASCR July 22 Call for Papers: Workshop on Energy-Efficient Computing for Science

The Advanced Scientific Computing Research (ASCR) program in the US Department of Energy (DOE) Office of Science is organizing a Workshop on Energy-Efficient Computing...

TII Quantum Technology Symposium January 27-29 in Abu Dhabi
From insideHPC

TII Quantum Technology Symposium January 27-29 in Abu Dhabi

Abu Dhabi, UAE – 2nd July 2024: The Technology Innovation Institute (TII), a scientific research center and the applied research pillar of the Abu Dhabi’s Advanced...

Altair to Acquire EDA Company Metrics Design Automation
From insideHPC

Altair to Acquire EDA Company Metrics Design Automation

TROY, Mich., July 1, 2024 – Altair (Nasdaq: ALTR) announced it has agred to acquire the outstanding capital stock of Metrics Design Automation Inc. (Metrics), a...

DDN Wins 2024 AI Breakthrough Award
From insideHPC

DDN Wins 2024 AI Breakthrough Award

CHATSWORTH, Calif. – July 1, 2024 – AI and multi-cloud data management solutions company DDN announced it has won its fourth “AI Hardware Innovation Award,” resulting...

RAVEL Adds to Executive Team
From insideHPC

RAVEL Adds to Executive Team

Seattle – June 27, 2024 – RAVEL Inc (formerly StratusCore) today announced the addition of three new members of its executive staff – Philippa Carroll, Kaveh Gourdarzian...

Diraq Quantum Adds Deeptech and Venture Investors to $22M Investment Round 
From insideHPC

Diraq Quantum Adds Deeptech and Venture Investors to $22M Investment Round 

SYDNEY, AUSTRALIA – JUNE 24, 2024 – Quantum computing company Diraq today announced the expansion of its investment round, bringing the total raised to USD $22Diraq...

CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act
From insideHPC

CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act

GRENOBLE, France – June 24, 2024 – CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a project aimed at advancing semiconductor technologies...
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