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Pasqal and Welinq Partner to Develop Quantum Interconnects
From insideHPC

Pasqal and Welinq Partner to Develop Quantum Interconnects

Paris – April 23, 2024 – Neutral atom quantum computing company Pasqal and Welinq, a quantum networking company, today announced a partnership intended to to address...

atNorth Names New Chief Development Officer
From insideHPC

atNorth Names New Chief Development Officer

Reykjavík, Iceland – April 23,  2024 – atNorth, a Nordic colocation, high-performance computing, and artificial intelligence service provider, has announced the...

Xinnor and Versatus Partner on HPC and AI Storage Solutions
From insideHPC

Xinnor and Versatus Partner on HPC and AI Storage Solutions

Haifa, Israel and San Paulo, Brazil – April 23, 2024: Xinnor, a provider of high-performance software RAID solutions, and Versatus HPC, an advisor and integrator...

DOE Awards $16M for Traineeships in Accelerator Science & Engineering
From insideHPC

DOE Awards $16M for Traineeships in Accelerator Science & Engineering

April 18, 2024 — Today, the U.S. Department of Energy (DOE) announced $16 million in funding for four projects providing classroom training and research opportunities...

Former Intel Executive Thomas Lantzsch Joins Canatu Board
From insideHPC

Former Intel Executive Thomas Lantzsch Joins Canatu Board

VANTAA, FINLAND, April 16, 2024 — Canatu, a developer of carbon nanotubes (Canatu CNTs) and manufacturing equipment for the semiconductor and automotive industries...

Exaion and PINQ² to Launch the HPC-Quantum Platform in Quebec
From insideHPC

Exaion and PINQ² to Launch the HPC-Quantum Platform in Quebec

Montreal and Paris, April 12, 2024: Exaion, a Canadian subsidiary of the EDF Group (Électricité de France), a developer of digital service platforms aimed at eco...

TSMC in the USA: Up to $6.6B in CHIPS Act Funding for 3rd (2nm or More) Arizona Fab
From insideHPC

TSMC in the USA: Up to $6.6B in CHIPS Act Funding for 3rd (2nm or More) Arizona Fab

TSMC announced it has signed a preliminary agreement with the U.S. Dept. of Commerce for up to $6.6 billion under the CHIPS and Science Act. TSMC also announced...

AI Startup Partners with Princeton on DARPA In-Memory AI Chip Project
From insideHPC

AI Startup Partners with Princeton on DARPA In-Memory AI Chip Project

An AI startup co-founded by a Princeton University professor has won an $18.6 million DOD grant to develop an in-memory chip built to deliver faster, more efficient...

LiquidStack Opens Manufacturing Facility and Global HQ in Texas
From insideHPC

LiquidStack Opens Manufacturing Facility and Global HQ in Texas

CARROLLTON, TX–March 5, 2024– Data center liquid cooling company LiquidStack today announced its new U.S. manufacturing site and headquarters in Carrollton, Texas...

Pawsey Adds NVIDIA CUDA Quantum Platform for R&D Simulations
From insideHPC

Pawsey Adds NVIDIA CUDA Quantum Platform for R&D Simulations

SYDNEY—SCA2024—Feb. 19, 2024—NVIDIA today announced that Australia’s Pawsey Supercomputing Research Centre will add the NVIDIA CUDA Quantum platform accelerated...
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