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Communications of the ACM


Chips Go Upscale

electronic 'glue' and stacked semiconductors, illustration

Developed by IBM and 3M, a new type of electronic "glue" can be used to construct stacks of semiconductors. The glue, shown here in blue, connects up to 100 separate chips and conducts heat away from the silicon package.

Credit: IBM

After decades in Flatland, the end of Moore's Law is pushing semiconductors into the third dimension.

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