Sign In

Communications of the ACM

ACM News

DARPA Wants Teeny-Tiny Fluids to Cool Down Next-Gen Microchips

View as: Print Mobile App Share:
Stacked chips

Conceptual image for 3D stacked microchips by IBM that could possibly lead to a chip 1,000 times more powerful than whats in use today. But is it too hot?

Credit: IBM

The Pentagon's mad scientists have concocted a plan to keep the miniature, stacked brains of tomorrow's advanced computers cool enough to power next-gen technological advances.

From Wired
View Full Article



No entries found

Sign In for Full Access
» Forgot Password? » Create an ACM Web Account